Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability - Woodhead Publishing Series in Electronic and Optical Materials (Paperback)Katsuaki Suganuma (editor)
Paperback 240 Pages / Published: 30/05/2018
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Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic.
Publisher: Elsevier Science & Technology
Number of pages: 240
Weight: 400 g
Dimensions: 229 x 152 mm
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