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Wafer Bonding: Applications and Technology - Springer Series in Materials Science 75 (Hardback)
  • Wafer Bonding: Applications and Technology - Springer Series in Materials Science 75 (Hardback)
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Wafer Bonding: Applications and Technology - Springer Series in Materials Science 75 (Hardback)

(volume editor), (editor)
£219.99
Hardback 504 Pages / Published: 14/05/2004
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The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Publisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
ISBN: 9783540210498
Number of pages: 504
Weight: 1035 g
Dimensions: 235 x 155 x 33 mm
Edition: 2004 ed.


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From the reviews:

"Wafer bonding, also known as direct wafer bonding or wafer fusion, has developed from an almost obscure niche technology in the 1980s ... . Anyone interested in learning about the basics of wafer bonding and its various application areas, will likely be served by this outstanding volume while the researcher engaged in studies on applied and technological aspects of wafer bonding, will find up-to-date information about this fast-moving area, including relevant patent information." (Current Engineering Practice, Vol. 47 (3), 2004 - 2005)

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