Titanium Nickel Silver and Gold Die Backside Metalization for Quad Flat Nolead Package Thermal Resistance Reduction (Paperback)Hung Chau (author)
Paperback Published: 01/09/2011
- Not available
Publisher: Proquest, Umi Dissertation Publishing
Weight: 95 g
Dimensions: 254 x 203 x 3 mm
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