Thermo-Mechanical Reliability of Three-Dimensional Interconnects Containing Through-Silicon-Vias (Tsvs) (Paperback)
  • Thermo-Mechanical Reliability of Three-Dimensional Interconnects Containing Through-Silicon-Vias (Tsvs) (Paperback)
zoom

Thermo-Mechanical Reliability of Three-Dimensional Interconnects Containing Through-Silicon-Vias (Tsvs) (Paperback)

(author)
£59.00
Paperback Published: 01/05/2012
  • Not available

This product is currently unavailable.

  • This item has been added to your basket

Publisher: Proquest, Umi Dissertation Publishing
ISBN: 9781248956397
Weight: 304 g
Dimensions: 254 x 203 x 10 mm

You may also be interested in...

Engineering
Added to basket
£9.99
Paperback
Mathematics for Engineers (with CD)
Added to basket
Inventions that Didn't Change the World
Added to basket
Science for Engineering, 5th ed
Added to basket
The Forth Bridge
Added to basket
£12.99
Paperback
Isambard Kingdom Brunel
Added to basket
Engineering Mathematics
Added to basket
Who Owns The Future?
Added to basket
Leonardo da Vinci
Added to basket
Making It, 2nd edition
Added to basket
BTEC National Engineering, 3rd ed
Added to basket

Reviews

Please sign in to write a review

Your review has been submitted successfully.