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Thermo-Mechanical Reliability of Three-Dimensional Interconnects Containing Through-Silicon-Vias (Tsvs) (Paperback)
  • Thermo-Mechanical Reliability of Three-Dimensional Interconnects Containing Through-Silicon-Vias (Tsvs) (Paperback)
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Thermo-Mechanical Reliability of Three-Dimensional Interconnects Containing Through-Silicon-Vias (Tsvs) (Paperback)

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£59.00
Paperback Published: 01/05/2012
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Publisher: Proquest, Umi Dissertation Publishing
ISBN: 9781248956397
Weight: 304 g
Dimensions: 254 x 203 x 10 mm

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