The Physics of Submicron Lithography - Microdevices (Hardback)
  • The Physics of Submicron Lithography - Microdevices (Hardback)

The Physics of Submicron Lithography - Microdevices (Hardback)

Hardback 493 Pages / Published: 31/03/1992
  • We can order this

Usually dispatched within 3 weeks

  • This item has been added to your basket
This book is devoted to the physics of electron-beam, ion-beam, optical, and x-ray lithography. The need for this book results from the following considerations. The astonishing achievements in microelectronics are in large part connected with successfully applying the relatively new technology of processing (changing the prop erties of) a material into a device whose component dimensions are submicron, called photolithography. In this method the device is imaged as a pattern on a metal film that has been deposited onto a transparent substrate and by means of a broad stream of light is transferred to a semiconductor wafer within which the physical structure of the devices and the integrated circuit connections are formed layer by layer. The smallest dimensions of the device components are limited by the diffraction of the light when the pattern is transferred and are approximately the same as the wavelength of the light. Photolithography by light having a wavelength of A ~ 0.4 flm has made it possible to serially produce integrated circuits having devices whose minimal size is 2-3 flm in the 4 pattern and having 10-105 transistors per circuit.

Publisher: Springer Science+Business Media
ISBN: 9780306435782
Number of pages: 493
Weight: 2600 g
Dimensions: 254 x 178 x 25 mm
Edition: 1992 ed.

You may also be interested in...

True Genius
Added to basket
The Oxford Solid State Basics
Added to basket
Particle or Wave
Added to basket
A Dictionary of Physics
Added to basket
Atomic Physics
Added to basket
Brownian Motion Calculus
Added to basket
Added to basket
Statistical Mechanics
Added to basket
Concepts in Thermal Physics
Added to basket

Please sign in to write a review

Your review has been submitted successfully.