Vertically-integrated 3D Multiprocessor Systems-on-Chip (3D MPSoCs) provide the means to continue integrating more functionality within a unit area while enhancing manufacturing yields and runtime performance. However, 3D MPSoCs are subject to amplified thermal challenges that undermine the corresponding reliability. To address these issues, several advanced cooling technologies alongside temperature-aware design-time optimizations and run-time management schemes have been proposed. Temperature-Aware Design and Management for 3D Multi-Core Architectures surveys recent advances in temperature-aware 3D MPSoC considerations. It explores the recent advanced cooling strategies, thermal modeling frameworks, design-time optimizations, and run-time thermal management schemes that are primarily targeted for 3D MPSoCs. As such, it provides a global perspective, highlighting the advancements and drawbacks of the recent state-of-the-art. While the primary focus is on existing methodologies and techniques, it also provides some insights on possible future directions related to this research discipline - temperature-aware design and management. Temperature-Aware Design and Management for 3D Multi-Core Architectures is an ideal primer for researchers and practitioners working in this area.
Publisher: now publishers Inc
Number of pages: 96
Weight: 145 g
Dimensions: 234 x 156 x 5 mm
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