Study of Tin-Silver-Copper Alloy Reliability Through Material Microstructure Evolution and Laser Moire Interferometry (Paperback)Krishna Rajaram Tunga (author)
Paperback Published: 01/10/2011
- Not available
Publisher: Proquest, Umi Dissertation Publishing
Weight: 191 g
Dimensions: 254 x 203 x 6 mm
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