Study of Tin-Silver-Copper Alloy Reliability Through Material Microstructure Evolution and Laser Moire Interferometry (Paperback)
  • Study of Tin-Silver-Copper Alloy Reliability Through Material Microstructure Evolution and Laser Moire Interferometry (Paperback)
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Study of Tin-Silver-Copper Alloy Reliability Through Material Microstructure Evolution and Laser Moire Interferometry (Paperback)

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£59.00
Paperback Published: 01/10/2011
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Publisher: Proquest, Umi Dissertation Publishing
ISBN: 9781244947191
Weight: 191 g
Dimensions: 254 x 203 x 6 mm

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