Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly (Paperback)Jennie S. Hwang (author)
- We can order this
Number of pages: 456
Weight: 703 g
Dimensions: 229 x 152 x 25 mm
Edition: Softcover reprint of the original 1st ed. 198
You may also be interested in...
Please sign in to write a review