Solder Joint Technology: Materials, Properties, and Reliability - Springer Series in Materials Science 92 (Hardback)King-Ning Tu (author)
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The European Union's directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.
Publisher: Springer-Verlag New York Inc.
Number of pages: 370
Weight: 1590 g
Dimensions: 235 x 156 x 23 mm
Edition: 2007 ed.