This volume contains the proceedings of the 12th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2007, held September 2007 in Vienna, Austria. It provides a global forum for the presentation and discussion of recent advances and developments in the theoretical description, physical modeling and numerical simulation and analysis of semiconductor fabrication processes, device operation and system performance.
Publisher: Springer Verlag GmbH
Number of pages: 463
Weight: 823 g
Dimensions: 244 x 170 x 25 mm
Edition: Softcover reprint of the original 1st ed. 200
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