Sensing, Modeling and Simulation in Emerging Electronic Packaging International Mechanical Engineering Congress and Exposition, Atlanta, Georgia, November 17-22, 1996 - EEP (Paperback)
  • Sensing, Modeling and Simulation in Emerging Electronic Packaging International Mechanical Engineering Congress and Exposition, Atlanta, Georgia, November 17-22, 1996 - EEP (Paperback)
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Sensing, Modeling and Simulation in Emerging Electronic Packaging International Mechanical Engineering Congress and Exposition, Atlanta, Georgia, November 17-22, 1996 - EEP (Paperback)

£65.95
Paperback 132 Pages / Published: 30/11/1996
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Presents 15 papers from the November 1996 congress reflecting the state-of-the-art modeling, simulation, and sensing technologies used in emerging electronic packaging applications, especially flip chip and ball grid array (BGA). Subjects include curing analysis of a flip- chip-on-board electronic p

Publisher: American Society of Mechanical Engineers,U.S.
ISBN: 9780791815489
Number of pages: 132

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