Proceedings Workshop Polymeric Matls Microelectronics & Photonics Applications: Mechanics Physics Re (G01157) - Eep 27 (Paperback)American Society of Mechanical Engineers (creator)
Paperback 291 Pages / Published: 01/01/1999
- Not available
The 33 papers from the December 1999 workshop report on current knowledge in the field of mechanics, physics and reliability of polymers, particularly those used in plastic packages of integrated circuit (IC) devices. Topics include fracture and damage investigations enhancing the thermo-mechanical reliability of plastic packages, the effect of polymer material properties on wire bonding to MCMs and advanced copper-low-K ICs, evaluation of the moisture sensitivity of molding compounds of IC packages, the influence of visco-elastic polymeric materials on flexural vibrations, application of the probabilistic approach in thermal stress modeling of packaging, and fiber optic sensor evaluation of epoxy-cured fiber optic connectors. No subject index.
Publisher: American Society of Mechanical Engineers,U.S.
Number of pages: 291
You may also be interested in...
Please sign in to write a review
Thank you for your reservation
Your order is now being processed and we have sent a confirmation email to you at
When will my order be ready to collect?
Call us on or send us an email at
Unfortunately there has been a problem with your order
Please try again or alternatively you can contact your chosen shop on or send us an email at