Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement (Hardback)
  • Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement (Hardback)
zoom

Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement (Hardback)

(author), (author)
£104.00
Hardback 226 Pages / Published: 28/03/2019
  • We can order this

Usually dispatched within 1 week

  • This item has been added to your basket

As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.

Publisher: Taylor & Francis Ltd
ISBN: 9780367023430
Number of pages: 226
Weight: 481 g
Dimensions: 235 x 156 mm

You may also be interested in...

Encyclopedia of Electronic Components
Added to basket
Arduino in Easy Steps
Added to basket
Exploring Arduino
Added to basket
£26.99
Paperback
Electronic Projects for the Garden
Added to basket
Getting the Most from Your Multimeter
Added to basket
The Lego Mindstorms Ev3 Discovery Book
Added to basket
Temporary Power Systems
Added to basket
Getting Started with Drones
Added to basket
Robotics: A Very Short Introduction
Added to basket
Arduino Workshop
Added to basket
£24.99
Paperback
Electronics All-in-One For Dummies - UK
Added to basket
The Oxford Solid State Basics
Added to basket

Please sign in to write a review

Your review has been submitted successfully.