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Plasma-Activated Fusion Bonding for Vacuum Encapsulation of Microdevices (Paperback)
  • Plasma-Activated Fusion Bonding for Vacuum Encapsulation of Microdevices (Paperback)
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Plasma-Activated Fusion Bonding for Vacuum Encapsulation of Microdevices (Paperback)

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£59.00
Paperback Published: 01/09/2011
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Publisher: Proquest, Umi Dissertation Publishing
ISBN: 9781244039339
Weight: 268 g
Dimensions: 246 x 189 x 8 mm

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