This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
Publisher: Springer-Verlag New York Inc. ISBN: 9781493955909 Number of pages: 402 Weight: 7086 g Dimensions: 235 x 155 mm Edition: Softcover reprint of the original 1st ed. 201
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