Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Publisher: Springer International Publishing AG
Number of pages: 969
Weight: 1352 g
Dimensions: 235 x 155 x 49 mm
Edition: Softcover reprint of the original 2nd ed. 201
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