Proceedings of the 28th International Symposium for Testing and Failure Analysis, 3-7 November 2002, Phoenix, Arizona. This proceedings volume presents in-depth coverage of the latest developments and the most advanced techniques for microelectronics failure analysis. The CD-ROM provides the complete content of the book in searchable Adobe Acrobat PDF format. Contents: Advanced Microelectronic Failure Analysis Techniques Metrology and Materials Analysis Package Level Analysis Microelectromechanical Systems Sample Preparation Failure Analysis Processes System Level Analysis Die Level Fault Isolation Discretes/Passives Scanning Probe Microscopy Techniques Test Analysis Optical Probing Yield Enhancement. (+ VAT)
Publisher: ASM International
Number of pages: 750
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