Proceedings of the 27th International Symposium for Testing and Failure Analysis, 11-15 November 2001, Santa Clara, California. This proceedings volume presents in-depth coverage of the latest developments and the most advanced techniques for microelectronics failure analysis. The CD-ROM provides the complete content of the book in searchable Adobe Acrobat PDF format. Contents include: Advanced techniques Packaging Backside analysis Scanning probe microscopy Focused ion beam (FIB) techniques Failure analysis of micro-electromechanical systems (MEMS) Yield improvement Discretes Defect-based testing Case histories.
Publisher: ASM International
Number of pages: 550
Dimensions: 230 x 156 mm
You may also be interested in...
Thank you for your reservation
Your order is now being processed and we have sent a confirmation email to you at
When will my order be ready to collect?
Call us on or send us an email at
Unfortunately there has been a problem with your order
Please try again or alternatively you can contact your chosen shop on or send us an email at