International Symposium on Electronic Materials and Packaging (Map) (Paperback)
  • International Symposium on Electronic Materials and Packaging (Map) (Paperback)
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International Symposium on Electronic Materials and Packaging (Map) (Paperback)

£145.95
Paperback 490 Pages / Published: 31/12/2000
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Topics covered by this title include: flip chip running; solder join reliability; emerging technologies; solder materials; delimitation; polymers for packaging; design and process; modelling and testing; material characterization; and package reliability.

Publisher: I.E.E.E.Press
ISBN: 9780780366541
Number of pages: 490

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