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International Conference on Multichip Modules and High Density Packing 1998 (Paperback)Institute of Electrical and Electronics Engineers
Paperback Published: 31/08/1998
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This volume covers topics including: multichip modules; micro/chip scale packaging; advanced PWBs; portables and IC packaging; MCM thermal management; modern wirebonding technology; polymers for electronic packaging; and materials, processes and reliability.