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International Conference on Multichip Modules and High Density Packing 1998 (Paperback)
  • International Conference on Multichip Modules and High Density Packing 1998 (Paperback)

International Conference on Multichip Modules and High Density Packing 1998 (Paperback)

£127.95
Paperback Published: 31/08/1998
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This volume covers topics including: multichip modules; micro/chip scale packaging; advanced PWBs; portables and IC packaging; MCM thermal management; modern wirebonding technology; polymers for electronic packaging; and materials, processes and reliability.

Publisher: I.E.E.E.Press
ISBN: 9780780348509

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