This book addresses two main problems with interconnections at the chip and package level: crosstalk and simultaneous switching noise. Its orientation is towards giving general information rather than a compilation of practical cases. Each chapter contains a list of references for the topics.
Publisher: Springer-Verlag New York Inc.
Number of pages: 195
Weight: 387 g
Dimensions: 235 x 155 x 11 mm
Edition: Softcover reprint of the original 1st ed. 200
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