Advances in thin-film layer transfer processes have opened new routes to multimaterial integration for monolithically integrated heterogeneous components and microsystems, circumventing many of the constraints for epitaxial growth of heterogeneous materials systems. Several methods for wafer bonding and lift-off are now in use for commercial production of silicon-on-insulator wafers. As the range of materials and device complexity increases, the need grows for a fundamental understanding of mechanical, electrical and chemical processes at bonded interfaces and within the components of multimaterial laminated structures. Details of layer exfoliation and transfer mechanisms also require investigation. This book, first published in 2003, addresses the science, engineering innovations and applications of multimaterial integration. Topics range from heteroepitaxy to wafer bonding and layer transfer.
Publisher: Cambridge University Press
Weight: 210 g
Dimensions: 229 x 152 x 8 mm
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