High Frequency Communication and Sensing: Traveling-Wave Techniques introduces novel traveling wave circuit techniques to boost the performance of high-speed circuits in standard low-cost production technologies, like complementary metal oxide semiconductor (CMOS). A valuable resource for experienced analog/radio frequency (RF) circuit designers as well as undergraduate-level microelectronics researchers, this book:Explains the basics of high-speed signaling, such as transmission lines, distributed signaling, impedance matching, and other common practical RF background materialPromotes a dual-loop coupled traveling wave oscillator topology, the trigger mode distributed wave oscillator, as a high-frequency multiphase signal sourceIntroduces a force-based starter mechanism for dual-loop, even-symmetry, multiphase traveling wave oscillators, presenting a single-loop version as a force mode distributed wave antenna (FMDWA)Describes higher-frequency, passive inductive, and quarter-wave-length-based pumped distributed wave oscillators (PDWOs)Examines phased-array transceiver architectures and front-end circuits in detail, along with distributed oscillator topologiesDevotes a chapter to THz sensing, illustrating a unique method of traveling wave frequency multiplication and power combiningDiscusses various data converter topologies, such as digital-to-analog converters (DACs), analog-to-digital converters (ADCs), and GHz-bandwidth sigma-delta modulatorsCovers critical circuits including phase rotators and interpolators, phase shifters, phase-locked loops (PLLs), delay-locked loops (DLLs), and more
It is a significantly challenging task to generate and distribute high-speed clocks. Multiphase low-speed clocks with sharp transition are proposed to be a better option to accommodate the desired timing resolution. High Frequency Communication and Sensing: Traveling-Wave Techniques provides new horizons in the quest for greater speed and performance.
Publisher: Taylor & Francis Ltd
Number of pages: 152
Weight: 272 g
Dimensions: 235 x 159 mm
-James Chu, Kennesaw State University, Marietta, Georgia, USA, from IEEE Microwave Magazine, September 2015
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