Harmonic and Random Vibration Durability Investigation for Tin-Silver-Copper Solder Interconnects (Paperback)
  • Harmonic and Random Vibration Durability Investigation for Tin-Silver-Copper Solder Interconnects (Paperback)
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Harmonic and Random Vibration Durability Investigation for Tin-Silver-Copper Solder Interconnects (Paperback)

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£59.00
Paperback Published: 01/09/2011
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Publisher: Proquest, Umi Dissertation Publishing
ISBN: 9781244027169
Weight: 485 g
Dimensions: 254 x 203 x 16 mm

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