This is the only book to teach microsystems packaging - written by the field's leading author. This is the book that engineers, technicians, and students want - the first to teach microsystems packaging from the ground up. Rao Tummala's one-stop "Fundamentals to Microsystems Packaging" covers the field from wafer to systems, including every major contributing technology. It's the only book to do so.This much-needed tool features: a comprehensive tutorial covering every major aspect of microelectronics, photonics, RF, packaging design, assembly, reliability, testing, manufacturing and its relevance to both semiconductors and systems; rigorous coverage of electrical, mechanical, chemical, and materials aspects of each technology; easy-to-read schematics and block diagrams; fundamental approaches to all system issues; examples of all common configurations and technologies - wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others; details on chip-to-board connections, sealing and encapsulation, and manufacturing processes; basics of electrical and reliability testing; hundreds of explanatory two-color illustrations; self-test problems and solutions in every chapter; and, glossary.
This title provides the best way to learn microsystems packaging through self-study or in a classroom - and the most comprehensive on-the-job reference. It covers MICROSystems packaging from the ground up.
Publisher: McGraw-Hill Education - Europe
Number of pages: 967
Weight: 1587 g
Dimensions: 236 x 188 x 42 mm