Electronic Packaging and Interconnection Handbook (Hardback)Charles A. Harper (author)
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Here's everything you need to know about materials, thermal management, mechanical and thermomechanical stress behavior, wiring and cabling, soldering and solder technology, integrated circuit packaging, surface mount technologies, rigid and flexible printed wiring boards. And with over 60% new material, this third edition brings you thoroughly up to speed on a new generation of packaging technologies: single chip packaging...ball gridarrays...chip scale packaging...low-cost flip chiptechnologies...direct chip attach, and more.
Publisher: McGraw-Hill Education - Europe
Number of pages: 992
Weight: 1574 g
Dimensions: 236 x 160 x 61 mm
Edition: 3rd edition
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