Development and Fabrication of Packaging Methodologies Compatible with Spray Cooling of Power Electronic Modules (Paperback)
  • Development and Fabrication of Packaging Methodologies Compatible with Spray Cooling of Power Electronic Modules (Paperback)
zoom

Development and Fabrication of Packaging Methodologies Compatible with Spray Cooling of Power Electronic Modules (Paperback)

(author)
£59.00
Paperback Published: 01/09/2011
  • Not available

This product is currently unavailable.

  • This item has been added to your basket

Publisher: Proquest, Umi Dissertation Publishing
ISBN: 9781243715425
Weight: 354 g
Dimensions: 246 x 189 x 10 mm

You may also be interested in...

Reviews

Please sign in to write a review

Your review has been submitted successfully.