Design for High Performance, Low Power, and Reliable 3D Integrated Circuits (Paperback)
  • Design for High Performance, Low Power, and Reliable 3D Integrated Circuits (Paperback)
zoom

Design for High Performance, Low Power, and Reliable 3D Integrated Circuits (Paperback)

(author)
£109.99
Paperback 560 Pages / Published: 16/12/2014
  • We can order this

Usually dispatched within 3 weeks

  • This item has been added to your basket
This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous "manufacturing-ready" GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.

Publisher: Springer-Verlag New York Inc.
ISBN: 9781489986962
Number of pages: 560
Weight: 8774 g
Dimensions: 235 x 155 x 30 mm
Edition: 2013 ed.

You may also be interested in...

Reviews

Please sign in to write a review

Your review has been submitted successfully.