Chemical-Mechanical Planarization of Semiconductor Materials - Springer Series in Materials Science 69 (Hardback)M. R. Oliver (volume editor)
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This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
Publisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
Number of pages: 428
Weight: 1760 g
Dimensions: 235 x 155 x 26 mm
Edition: 2004 ed.
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