With a particular emphasis on fabrication quality control, this volume in the "Materials Characterization" series focuses on characterization techniques used for critical junctures in package design like mold compound adhesion and strength, mechanical stress, moisture sensitivity, solderability of IC components, and interconnect systems. Readers will find: general overview of IC package reliability testing; characterization for the electrical performance of IC packages; understanding surface characteristics and interfaces for thermal management; and concise summaries of major characterization technologies for integrated circuit packaging materials, including acoustic microscopy, atomic absorption spectrometry, Auger Electron Spectroscopy, Energy-Dispersive X-Ray Spectroscopy, and many more.
Publisher: Momentum Press
Number of pages: 274
Weight: 576 g
Dimensions: 243 x 157 x 20 mm
You may also be interested in...
£52.99Mixed media product
Please sign in to write a review
Simply reserve online and pay at the counter when you collect. Available in shop from just two hours, subject to availability.
Thank you for your reservation
Your order is now being processed and we have sent a confirmation email to you at
When will my order be ready to collect?
Following the initial email, you will be contacted by the shop to confirm that your item is available for collection.
Call us on or send us an email at
Unfortunately there has been a problem with your order
Please try again or alternatively you can contact your chosen shop on or send us an email at