Main areas covered are:- The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation GBP/LISTGBP Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.
Number of pages: 192
Weight: 1040 g
Dimensions: 235 x 155 x 12 mm
Edition: 2000 ed.
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