Applications of Experimental Mechanics to Electronmic Packaging 1995: International Mechanical Engineering Congress and Exposition, San Francisco, California, November 12-17, 1995 - EEP S. v. 13 (Hardback)
  • Applications of Experimental Mechanics to Electronmic Packaging 1995: International Mechanical Engineering Congress and Exposition, San Francisco, California, November 12-17, 1995 - EEP S. v. 13 (Hardback)
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Applications of Experimental Mechanics to Electronmic Packaging 1995: International Mechanical Engineering Congress and Exposition, San Francisco, California, November 12-17, 1995 - EEP S. v. 13 (Hardback)

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£47.50
Hardback Published: 15/11/1995
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Publisher: American Society of Mechanical Engineers,U.S.
ISBN: 9780791817391

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