Applications of Experimental Mechanics of Electronic Packaging 1997: International Mechanical Engineering Congress and Exposition, Dallas, Texas, November 16-21, 1997 - EEP S. v. 22 (Hardback)J. Suhling (editor)
Hardback Published: 15/11/1997
- Not available
Proceedings of the November 1997 symposium, a forum for presentation of research in all aspects of experimental mechanics as applied to electronic packaging. Session topics included test chips, sensors, optical methods, micromechanical testing, and mechanics of thin film debonding.
Publisher: American Society of Mechanical Engineers,U.S.
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