Advances in Cryogenic Engineering - Advances in Cryogenic Engineering 23 (Paperback)
  • Advances in Cryogenic Engineering - Advances in Cryogenic Engineering 23 (Paperback)

Advances in Cryogenic Engineering - Advances in Cryogenic Engineering 23 (Paperback)

Paperback 586 Pages / Published: 19/05/2013
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The Second International Cryogenic Materials Conference (ICMC) was held in Boulder, Colorado, in conjunction with the 1977 Cryogenic Engineering Con- ference (CEC). Special thanks must be given to the University of Colorado for their skillful hosting of these two conferences. Collaboration between the two con- ferences has been mutually beneficial, providing the materials special ist with insight into new applications and design concepts and the cryogenic engineer with exposure to modern materials accomplishments and potentials. The Proceedings of the 1977 Cryogenic Engineering Conference are published in Volume 23 of Advances in Cryogenic Engineering. Both conferences will be held again simul- taneously in Madison, Wisconsin, in August 1979. The success and growth of the two International Cryogenic Materials Con- ferences have led to the formation of an ICMC Board of Directors. The board members will serve a four-year term and include: Chairman, R. P. Reed (U.S.), R. W. Boom (U.S.), A. F. Clark (U.S.), G. Hartwig (W. Germany), J. W. Morris (U.S.), M. Suenaga (U.S.), K. Tachikawa (Japan), J. Tanaka (Japan), and K. A. Yushchenko (USSR).

Publisher: Springer-Verlag New York Inc.
ISBN: 9781461398554
Number of pages: 586
Weight: 1158 g
Dimensions: 244 x 170 x 31 mm
Edition: Softcover reprint of the original 1st ed. 197

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