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Advanced Electronic Packaging - IEEE Press Series on Microelectronic Systems (Hardback)
  • Advanced Electronic Packaging - IEEE Press Series on Microelectronic Systems (Hardback)
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Advanced Electronic Packaging - IEEE Press Series on Microelectronic Systems (Hardback)

(editor), (editor)
£158.00
Hardback 840 Pages / Published: 23/05/2006
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As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained.

An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.

Publisher: John Wiley and Sons Ltd
ISBN: 9780471466093
Number of pages: 840
Weight: 1634 g
Dimensions: 262 x 186 x 48 mm
Edition: 2nd Edition


MEDIA REVIEWS
" a very nice reference." ( IEEE Circuits & Devices Magazine, November/December 2006)

"...offers a broad perspective on electronic packaging." (Advanced Packaging Online, August 11, 2006)

"...an extremely thorough engineering textbook and an invaluable reference tool...get ready for some serious reading that will pay off." (Chip Scale Review, July 2006)

" useful to not only students but also to both new and experienced engineers working in areas related to semiconductor and electronic packaging technologies." (CircuiTree, May 1, 2006)

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