Publisher: Springer International Publishing AG
Number of pages: 339
Weight: 6682 g
Dimensions: 235 x 155 x 21 mm
Edition: 1st ed. 2016
"The book is valuable as a learning tool for 3D stacked chips through TSVs ... . a valuable addition to a scientific library, as well as served as good introduction for device reliability engineers or specialists and industrials involved in the field of 3D stacking in wafer fabrication and integrated circuit design. ... highly recommended for people who desire a better understanding of the theory and practice of 3D TSVs and technical considerations in 3D chips floorplanning, modeling and characterization." (Chong Leong Gan and Uda Hashim, Microelectronics Reliability, Vol. 63, August, 2016)
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