2nd Electronic Packaging Technology Conference (CD-ROM)International Microelectronics and Packaging Society (other)
CD-ROM 467 Pages / Published: 28/02/2001
- Not available
Topics covered by this title include: packaging materials; packaging trends; thermal design and modelling; solder joint metallurgy; process and reliability modelling; thermal characterization; materials characterization techniques; and assembly/manufacturing technologies.
Number of pages: 467
Edition: Abridged edition
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