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2nd Electronic Packaging Technology Conference (CD-ROM)
  • 2nd Electronic Packaging Technology Conference (CD-ROM)
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2nd Electronic Packaging Technology Conference (CD-ROM)

£188.34
CD-ROM 467 Pages / Published: 28/02/2001
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Topics covered by this title include: packaging materials; packaging trends; thermal design and modelling; solder joint metallurgy; process and reliability modelling; thermal characterization; materials characterization techniques; and assembly/manufacturing technologies.

Publisher: I.E.E.E.Press
ISBN: 9780780366459
Number of pages: 467
Edition: Abridged edition

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