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2nd Electronic Packaging Technology Conference (Paperback)
  • 2nd Electronic Packaging Technology Conference (Paperback)
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2nd Electronic Packaging Technology Conference (Paperback)

£156.95
Paperback 480 Pages / Published: 01/01/2000
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Topics covered by this title include: packaging materials; packaging trends; thermal design and modelling; solder joint metallurgy; process and reliability modelling; thermal characterization; materials characterization techniques; and assembly/manufacturing technologies.

Publisher: I.E.E.E.Press
ISBN: 9780780366442
Number of pages: 480
Edition: Abridged edition

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