International Conference on Multichip Modules and High Density Packing 1998 (Paperback)

by Institute of Electrical and Electronics Engineers

Format: Paperback 562 pages

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This volume covers topics including: multichip modules; micro/chip scale packaging; advanced PWBs; portables and IC packaging; MCM thermal management; modern wirebonding technology; polymers for electronic packaging; and materials, processes and reliability.

Book details

Published
31/08/1998

Publisher
I.E.E.E.Press

ISBN
9780780348509


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